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ICS TRIPLEXT8431可编辑控制

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详细信息

产品标题: ICS TRIPLEXT8431可编辑控制

型号: T8431

品牌:  ICS

详情资料

T8431C ROCKWELL ICS TRIPLEX 控制器系统

使用T8431C 的预定义参考流程,可以快速轻松地执行选择合适子系统并确定其规模的标准化流程。当设计在在线配置器中完成时,可以通过网上商店检索3D CAD数据、开始查询或订购系统。为了大限度地减少安装时间,博世力士乐以预组装的形式提供选定的机器人系统。

如果需要,T8431C 可以提供完整的能源链和电缆管理。为了使调试更容易,相关的轴参数存储在电机编码器存储器中,可以自动读出。各种附件和接口使组装更容易。

输入模块自动对几个可用于详细故障排除和验证的车载信号模块操作特性。在每个内进行测量切片的HIU和FIU。从IMB到现场连接器,输入模块包含大量故障检测和完整性测试。作为一种输入设备,所有的测试都是在非干扰模式下执行。从IMB输入的数据存储在在HIU的每个片部分上的冗余纠错RAM。收到数据由每个切片投票决定。所有数据传输都包含一个确认

来自接收器的响应。在HIU和FIU之间,有一系列光学隔离的数据链路和动力。对数据链路进行同步并监控差异。二者都FIU和HIU都有机载温度传感器来表征与温度相关的问题。HIU和FIU板的电源都是冗余的,完全器化和可测试。这些组件共同构成电源完整性

子系统。

英文资料

T8431C ROCKWELL ICS TRIPLEX Controller System


Using the predefined reference process of T8431C, a standardized process for selecting suitable subsystems and determining their size can be quickly and easily executed. When the design is completed in the online configurator, 3D CAD data can be retrieved through the online store, and queries can be initiated or the system can be ordered. In order to minimize the installation time, Bosch Bosch Rexroth provides the selected robot system in the form of pre assembly.

If needed, T8431C can provide complete energy chain and cable management. To make debugging easier, the relevant shaft parameters are stored in the motor encoder memory and can be automatically read out. Various accessories and interfaces make assembly easier.

The input module automatically checks the operational characteristics of several onboard signal modules that can be used for detailed troubleshooting and verification. Measure the HIU and FIU of the slices within each. From IMB to on-site connectors, the input module contains a large number of fault detection and integrity testing. As an input device, all tests are executed in non-interference mode. The data input from IMB is stored in redundant error correction RAM on each chip of the HIU. The received data is determined by voting on each slice. All data transfers include a confirmation

Response from the receiver. There is a series of optically isolated data links and power between HIU and FIU. Synchronize the data link and monitor differences. Both FIUs and HIUs have onboard temperature sensors to characterize temperature related issues. The power supplies of HIU and FIU boards are redundant, fully modular, and testable. These components together constitute Power integrity

Subsystem.

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