SHL2-4000半片全自动激光划片裂片机介绍
一、半片全自动激光划片裂片机设备
二、全自动激光划片裂片机功能
适用于单晶硅和多晶硅材料太阳电池1/2等分划片和裂片,能够完成自动给料、自动定位划片、自动裂片、小片自动装盒等功能。
三、设备技术参数
四、全自动激光划片裂片机性能特点
1、划片工艺
采用532nm绿光光源,光程固定,光束质量好,激光划线宽度细,热影响区小;电池片切割断面更整齐,对电池片损伤小,切割
2、工作效率高
激光划片速度快,整机自动划程度高,设备产能可达3400整片/小时
3、定位
电池片CCD视觉定位,机器臂取片,定位精度≤0.1mm
4、自动化程度高
料盒自动传输、电池片自动上下料、自动定位、自动划片、自动裂片、小片自动装盒。性能稳定,故障率低,维护简单。
应用市场
太阳能行业单晶硅、多晶硅、硅片的划片(切割切片)。
太阳能行业单晶硅、多晶硅(cel太阳能行业单晶硅、多晶硅和硅片的划片/切割切片)。
电子行业单晶硅和多晶硅硅片的分离切割。
1、Equipment Introduction
Applied to scribe&split mono-crystalline silicon and poly-crystalline silicon solar cell into 1/2 piece, which can achieve automatic cell loading,automatic positioning scribing,automatic cell splitting,small cell load in box automatically and so on.
2、Technology Parameters
Model SHL2-4000
Laser power 20W
laser wavelength 532nm
Scribing speed Maximum 600mm/s
Scribing line width ≤25μm
Hot affected area ≤60μm
Scribing line depth 20-120μm;(adjustable)
Scribing accuracy ±0.1mm
Positioning method CCD visual positioning
Cell breaking method Mechanical cell breaking
Scribing capacity 3400 full cells/hr
Breakage rate ≤1‰(Positive A class)
Solar cell specification 156×156-158×158mm
Size 2000×1500×1800mm
Net Weight 1200kg
3、Equipment Feature
Advanced scribing technology
adopt 532nm green laser,fixed light path,good quality beam,slim laser scribing line,small hot affected area;more uniform solar cell cutting surface,small damage to solar cell,high accuracy cutting.
High working efficiency
High laser scribing speed that could reach to 3400pcs/hr, high automation level
High accuracy positioning
Solar cell CCD visual positioning, high accuracy mechanical arm cell loading, positioning accuracy≤0.1mm
High automation level
Cell basket automatic transfer, solar cell automatic loading and unloading, automatic positioning, automatic scribing, small cell load in box automatically. Stable performance, low failure rate, easy maintenance