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GE CPU模块IC693CPU313

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GE CPU模块IC693CPU313

采用隔离运放的系统架构和TI明星产品。涉及了相关电路设计和外部信号调理与MCU的配合。结合后级ADC,深入讨论了隔离运放单端结构输出和差分结构输出对整体采样性能的影响,提供了相应的分析和建议。

总结来说,如果采用内置差分输入ADC的MCU,比如C2000系列的TMS320F2837x,可以免去中间电路,直接将差分运放的输出接到对应的差分输入ADC模块,同时获得的精度和信噪比;如果采用内置单端输入ADC的MCU,添加一颗简单运放比如TLV6001,可以在实现差分转单端的同时进行信号调理可以更加地适配后级ADC的输入要求。如果想要省去额外调理运放,可以采用一端电阻接地,但需要考虑对于采样准确度和信噪比的不良影响。


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联系方式
  • 联系人: 欧阳 先生
  • 职位: 销售
  • 真: 0592-5917519
  • 电话: 0592-5709821
  • 手机: 18030229050
  • 址: 福建省 厦门市 厦门市海沧区沧湖东一里502号702室之一
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