品牌:思泰克 | 规格:s8030-2 | 材质:进口 |
产地:厦门 |
一、S8030系列产品描述及规格:
1、可编程相位调制轮廓测量技术(PSLM PMP):思泰克发明专利,其的可编程结构光栅使用软件即可对光栅的周期进行设置;取消了机械驱动及传动部分,大大提高了设备的精度及适用范围,避免了机械磨损和维修成本。实现对SMT生产线中精密印刷焊锡膏进行100%的三维测量。
2、思泰克专利同步结构光技术解决了锡膏三维检测中的阴影效应干扰。结合RG二维光源处理高对比度的基板,如黑色基板,陶瓷基板等。采用红、蓝、绿三色光,可提供彩色2D图像;
3、高解析度图像处理系统:帧数500万像素工业CCD相机,配合镜头,支持对01005锡膏的快速稳定检测。同时提供10um、15um、18um、20um等多种不同的检测精度,配合客户的产品多样性和检测速度的要求;
4、快速Gerber导入及编程软件,可实现5分钟编程;人工Teach功能方便使用者在无Gerber数据时的编程及检测;
5、Z轴实时动态仿形:PSLM的特点提供了对PCB的翘曲变化进行实时动态跟踪,解决柔性线路板和PCB翘曲问题。
6、强大的过程统计分析功能(SPC):实时SPC信息显示,完整多样的SPC工具,让使用者实时监控生产中的问题,减少由于锡膏印刷不良造成的缺陷。提供给操作人员强有力的品管支持,让使用者一目了然;
7、设备重复性精度<<10% (6 Sigma)。
二、设备软硬件配置:
技术参数/Parameters | |||
产品定位Product Describtion | 标准机 Standard Model | ||
产品系列 Series | S8030 | ||
测量原理 Measurement Principle | 3D 白光 PSLM PMP (可编程结构光栅相位调制轮廓测量技术,俗称摩尔条纹技术) 3D white light PSLM PMP(Programmable Spatial Light Modulation,commonly known as moire fringe technology) | ||
测量项目 Measurements | 体积,面积,高度,XY偏移,形状(volume,acreage,height, XY offset, shape ) | ||
检测不良类型 Detection of Non - Performing Types | 漏印、少锡、多锡、连锡、偏位、形状不良、板面污染 (missing print,insufficient tin, excessive tin, bridging, offset, mal-shapes, surface contamination) | ||
相机像素 Camera Pixel | 4M , 5M as option | ||
镜头类型 Lens Types | 长焦镜头,可选远心镜头 telephoto lens, telecentric lens as option | ||
镜头解析度 Lens Resolution | 18um,可选20um/15um(20um/15um as option) | ||
视野尺寸 FOV Size | 36*36mm | ||
精度 Accuracy | XY解析度(XY Resolution):1um;高度(Height):0.37um | ||
重复精度 Repeatability | height:≤1um (4 Sigma); volume/acreage:<1%(4 Sigma); | ||
检测重复性 Gage R&R | 远远小于10%(far less than10%) | ||
FOV速度 FOV Speed | 0.35s/FOV | ||
检测头数量 Quantity of Inspection Head | Single Head ,Twin-Heads as optipon) | ||
红绿蓝/RGB 三色光源 Red Green Blue/RGB Three Colas Option Light Source | 标配 standard configuration | ||
基准点检测时间 Mark-point Detection Time | 0.5sec/piece | ||
Z轴实时升降补偿板弯 Compensation Plate Bending of Real-time Lift in Z-axis | 标配standard configuration | ||
检测高度 Maximun Meauring Height | ±550um (±1200um as option) | ||
弯曲PCB测量高度 Maximun Measuring Height of PCB Warp | ±3.5mm(±5mm as option) | ||
焊盘间距 Minimum Pad Spacing | 100um (焊盘高度为150um的焊盘为基准 pad height of 150um as the reference) | ||
测量大小 Smallest Measuring Size | 长方形(rectangle):150um;圆形(round):200um | ||
PCB载板尺寸 Maximum Loading PCB Size | M尺寸:X330xY250mm L尺寸:X510xY505mm | ||
PCB板厚度 Thickness of the PCB | 0.4-7mm | ||
零件高度限制 Height Limitations of the Parts | up:30mm down:40mm | ||
板边距Board Edge Distance | 3mm ,可选夹边 multifunctional clip edge as option | ||
定动轨设置 Flixble or Fixed Orbit Setting | 前定轨(后定轨*选件)front orbit (back orbit as option) | ||
PCB传送方向 PCB Transfer Direction | 左到右、右到左,可选 left to right or right to left | ||
轨道宽度调整 Orbit Width Adjustment | 手动,可选自动 (manual , automatic as option) | ||
SPC统计数据 SPC Statistics | Histogram;Xbar-R Chart;Xbar-S Chart;CP&CPK;%Gage Repartability Data;SPI Daily/Weekly/Monthly Reports | ||
Gerber和CAD导入 Gerber & CAD Data Imput | 支持Gerber格式 (274x,274d)(support Gerber format);人工Teach模式 (manual Teach model) ;CAD X/Y,Part No.,Package Type等导入 (CAD X/Y,Part No.,Package Type imput) | ||
电脑类型 Computer Types | 戴尔服务器 DELL server | ||
电脑配置 Computer Configuration | 中央处理器 CPU | Intel 4-core | |
内存 RAM | 16G (24/32G as option) | ||
图像处理器 GPU | 2G discrete graphics | ||
硬盘 Hard Disk | 1T | ||
DVD+RW | standard configuration | ||
Operating System | Windows 7 Professional (64位 64 bit) | ||
设备规格 Equipment Diemension and Weight | S型:1000x1000x1525mm;830KG L型:1000x1000x1525mm;865KG | ||
电源 Power | 220V、10A | ||
气压 Air Pressure | 4~6Bar | ||
功率(启动/正常)Power (Start / nornmal) | 启动start:2.5kw / 正常运转 normal operation:2kw | ||
地面承重要求Loading Requirements of the Floor | 500kg/m² | ||
选配件 Options | 夹边、1D/2D Barcode扫描枪、Badmark功能、印刷机闭环控制、离线编程软件、维修工作站、动态读拼板Mark点功能、UPS不间断电源 multifunctional clip edge, 1D / 2D Barcode scanner, Badmark function, print closed-loop control, out-line programming software, maintenance was optionkstations, coaxial Mark point camera , UPS continuous power supply |